The Vapor Chamber is mounted in contact with the surface of the main chip and memory. Since the entire area transfers heat at the same rate, the Vapor-X module has been engineered to operate more efficiently than a copper heat sink at carrying away heat. Upon gaining heat, the heat source is pushed to the Vaporization Wicks to begin the heat dissipation process. Due to extreme low pressure, working fluid and pure water are easily vaporized, and transferred through the vacuum until reaching the Condensing Wick which is adjacent to the cooled surface. From here, it turns back to a liquid state whereby the liquid is then absorbed into the Transportation Wick by capillary action and moved back towards the Vaporization Wick. A recycled liquid system occurs when the heat source reheats the liquid and it becomes re-vaporized by the Vaporization Wick to restart the Vapor-X Cooling process.

The WAVE Fin Design reduces friction when the wind goes into the fin module resulting in a reduction of the wind cut noise. The V-shape fin design on top of the GPU accelerates and centralizes the air flow around the GPU to dissipate heat efficiently.

The Die Casted Aluminum-Magnesium Alloy Frame enveloping the sides of the PCB help to strengthen the structural stiffness of the shroud to create a strong, scratch resistant and high quality finish that elevates the aesthetic and strength of the graphics card. Overlaying the entire PCB, the die casted Frontplate Heatsink cools the VRM, Memory and Chokes resulting in superior heat dissipation for top-notch airflow and cooling performance.

SAPPHIRE NITRO+ and PULSE AMD Radeon RX 7900 Series are designed with digital power which provides accurate power control and excellent power efficiency.

The Ultra High Performance Conductive Polymer Aluminum Capacitor has a small PCB foot print but high volumetric capacitance that makes 20-phase power possible on the RX 7900 series graphics card. The capacitor offers stable capacitance at a high frequency and temperature with very low signal noise, ensuring the stability and reliability of the product.

The GPU is mounted on to the high-density 14 layer 2 oz Copper and high TG PCB to match the rapid speed, high current and increased power requirement of the GPU and memory to guarantee high stability of the PCB during operation.

The all-aluminum backplate provides additional rigidity that guarantees nothing bends and dust stays out. It also helps cool your card by increasing heat dissipation.

Dedicated VRM cooling module to create optimal heat dissipation for peak airflow and cooling performance.

The Angular Velocity Fan Blade provides a double layer of downward air pressure which alongside the air pressure on the outer ring of the Axial fan, results in up to 44% more downward air pressure and up to 19% more airflow for a quieter and cooler operation when compared to the previous generations.

The composite heatpipes are fine-tuned for each individual cooling design with optimal heat flow, efficiently and evenly spreading out the heat to the entire cooling module.

When the temperature of the GPU increases, the graphics card fans speed up accordingly. To further help with cooling and heat dissipation, the Assistive System Fan Control feature in SAPPHIRE's TriXX software controls the speed of a system fan to automatically increase at the same time as the graphics card fans, this assists in expelling the heated air from the entire system faster.

In order to protect your card, the SAPPHIRE cards have fuse protection built into the circuit of the external PCI-E power connector to keep the components safe.

These feature Dual Ball bearing fans, which have an approximately 85% longer lifespan than sleeve bearings in the tests. The improvements to the fan blades means the solution is up to 10% quieter than the previous generation.